Adhesion in Microelectronics

by K. L. Mittal & Tanweer Ahsan

Publisher: Wiley

Series: Adhesion and Adhesives: Fundamental and Applied Aspects

Publication Date: April 22, 2016

ISBN: 9781118831342

Binding: Kobo eBook

Availability: eBook

Other formats: Hardback

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of materials as it pertains to adhesion
  • Surface cleaning as it pertains to adhesion
  • Ways to improve adhesion
  • Unraveling of interfacial interactions using an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion  (metallized polymers)
  • Polymer adhesion to various substrates
  • Adhesion of thin films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of different dielectric materials
  • Delamination and reliability issues in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion measurement of thin films and coatings